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solder paste inspection 相關文章
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Built upon latest 3D projection technology, the TR7007DI SPI offers industry leading inspection accuracy for the most de...
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2020年10月22日 — Solder Paste Inspection, abbreviated as SPI, is a specialized process that evaluates/inspects solder pas...
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Viscom's compact SPI system inspects solder paste application in SMD production with maximum speed and precision. 3D fea...
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Accurate, whole measurement of every tiny objects such as 03015, requires true three-dimensional inspection. Only Koh Yo...
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Many solder paste printing machines contain 2D solder inspection which has been used for a long time but has a limited i...
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Optical inspection systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposi...
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2015年9月14日 — 錫量取決於鋼板的厚度與開孔,還有電路板上焊墊與綠漆+白漆高度差。 當不同板子的綠漆+白漆的厚度差異太大,就會造成錫膏量印刷的差異,大顆零件或許對 ...
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This method uses 3D imaging to detect issues such as scratches, stains, and nodules. It also measures volume, area, heig...
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A solder paste inspection machine (SPI machine) measures the height, volume, and area on paste deposits. It also compute...
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solder paste inspection 參考影音
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